Federal NAICS Codes

NAICS 334413

Semiconductor and Related Device Manufacturing

Explore obligations, trends, recent awards, and incumbent contractors for NAICS 334413.

NAICS 334413 federal market metrics

Total obligations
$3.7B
Total awards
61,105 awards
Active obligations
$401.1M
Size standard
1,250 employees

What this NAICS covers

NAICS 334413 covers fabrication and manufacturing of semiconductors and related devices, including wafer processing, die fabrication, packaging, assembly, electrical and environmental testing, and maintenance of process control and quality records for device production.

Federal opportunities under 334413 typically involve acquiring manufactured semiconductor devices or production services, including lot acceptance testing, qualification reports, manufacturing traceability, environmental and electrical test data, and delivery of parts with specified production and quality documentation.

FY2025 snapshot

Obligations
$168.6M
Awards
2,791
Average award
$60.4K
Change from FY2024
+9.7%

Recent awards

Search contractors

$99,310

AVNET INC

National Aeronautics and Space Administration

PIID
80NSSC26P0749
PSC
5999 - MISCELLANEOUS ELECTRICAL AND ELECTRONIC COMPONENTS

$120,832

AVNET INC

National Aeronautics and Space Administration

PIID
80NSSC26P0770
PSC
5999 - MISCELLANEOUS ELECTRICAL AND ELECTRONIC COMPONENTS

$131,486

STERILIZ, LLC

Department of Veterans Affairs

PIID
36C25026F0445
PSC
J065 - MAINT/REPAIR/REBUILD OF EQUIPMENT- MEDICAL, DENTAL, AND VETERINARY EQUIPMENT AND SUPPLIES

$90,900

KAPTEYN-MURNANE LABORATORIES, INC

National Institute of Standards and Technology

PIID
1333ND26PNB030107
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

$109,500

KIJERO, LLC

Federal Acquisition Service

PIID
47QSSC26P1JHN
PSC
6615 - AUTOMATIC PILOT MECHANISMS AND AIRBORNE GYRO COMPONENTS

$439,185

TECHNICAL COMMUNITIES, INC.

National Institute of Standards and Technology

PIID
1333ND26PNB030065
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

$2,050,999

SIGRAY, INC.

National Institute of Standards and Technology

PIID
1333ND26PNB030089
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

$16,235

POLYFET RF DEVICES, INC

Federal Aviation Administration

PIID
6973GH26P01512
PSC
5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE

FAQ

What work fits NAICS 334413?
  • Wafer fabrication run for a requested device process flow with lot-level identification, wafer maps, and electrical parametric data supplied to the procuring organization.
  • Assembly and packaging of semiconductor dies into specified packages with final electrical test reports, burn-in records, and lot traceability.
  • Supply of packaged microcontrollers or discrete devices with per-lot test summaries, acceptance data, and certificate of conformance.
  • Contracted production of photodiodes or sensor dies including die attach, encapsulation or packaging, and delivery of device-level test data.
When is NAICS 334413 a weak fit?
  • Integrated circuit design services where the primary deliverable is design files, RTL, or IP rather than fabrication and manufacturing process execution.
  • Printed circuit board assembly contracts where work centers on component placement and board-level assembly rather than wafer processing or semiconductor die fabrication.
  • Electronic systems box-build procurements where components are purchased and integrated into systems and the prime activity is assembly and integration, not semiconductor device manufacture.
What solicitation language points to NAICS 334413?
  • Requirements list cleanroom class or contamination control procedures, lot-level wafer maps, and supplier process flow documentation as contract deliverables.
  • Deliverables specify electrical parametric test data, device acceptance criteria, first article test reports, and lot traceability linked to serial or wafer identifiers.
  • Evaluation criteria request prior manufacturing runs, process control records, defect density metrics, and ability to provide per-lot test data and traceability.

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