Federal NAICS Codes

NAICS 334413: Semiconductor and Related Device Manufacturing

Explore obligations, trends, recent awards, and incumbent contractors for NAICS 334413.

NAICS 334413 federal market metrics

Total obligations
$3.8B
Total awards
61,360 awards
Active obligations
$418.8M
Size standard
1,250 employees

What this NAICS covers

NAICS 334413 covers fabrication and manufacturing of semiconductors and related devices, including wafer processing, die fabrication, packaging, assembly, electrical and environmental testing, and maintenance of process control and quality records for device production.

Federal opportunities under 334413 typically involve acquiring manufactured semiconductor devices or production services, including lot acceptance testing, qualification reports, manufacturing traceability, environmental and electrical test data, and delivery of parts with specified production and quality documentation.

FY2025 snapshot

Obligations
$184M
Awards
2,791
Average award
$65.9K
Change from FY2024
+13.6%

Recent awards

Search contractors

$47,400

K5 DEFENSE LLC

National Oceanic and Atmospheric Administration

PIID
1305M226P0175
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

$85,000

BIOTRONICS, INC

National Aeronautics and Space Administration

PIID
80NSSC26P1008
PSC
AJ12 - GENERAL SCIENCE AND TECHNOLOGY R&D SERVICES; GENERAL SCIENCE AND TECHNOLOGY; APPLIED RESEARCH

$104,640

NEWARK CORPORATION

Federal Acquisition Service

PIID
47QSWA26P15KH
PSC
6615 - AUTOMATIC PILOT MECHANISMS AND AIRBORNE GYRO COMPONENTS

$26,955

SKYWATER TECHNOLOGY FOUNDRY INC

National Institute of Standards and Technology

PIID
1333ND26PNB030073
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

$107,423

MPI AMERICA INC.

National Institute of Standards and Technology

PIID
1333ND26PNB670174
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

$35,560

CAMECA INSTRUMENTS, INC

National Institute of Standards and Technology

PIID
1333ND26PNB030204
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

$63,707

APPLIED NANOTOOLS INC

National Aeronautics and Space Administration

PIID
80NSSC26P0867
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

FAQ

What work fits NAICS 334413?
  • Wafer fabrication run for a requested device process flow with lot-level identification, wafer maps, and electrical parametric data supplied to the procuring organization.
  • Assembly and packaging of semiconductor dies into specified packages with final electrical test reports, burn-in records, and lot traceability.
  • Supply of packaged microcontrollers or discrete devices with per-lot test summaries, acceptance data, and certificate of conformance.
  • Contracted production of photodiodes or sensor dies including die attach, encapsulation or packaging, and delivery of device-level test data.
When is NAICS 334413 a weak fit?
  • Integrated circuit design services where the primary deliverable is design files, RTL, or IP rather than fabrication and manufacturing process execution.
  • Printed circuit board assembly contracts where work centers on component placement and board-level assembly rather than wafer processing or semiconductor die fabrication.
  • Electronic systems box-build procurements where components are purchased and integrated into systems and the prime activity is assembly and integration, not semiconductor device manufacture.
What solicitation language points to NAICS 334413?
  • Requirements list cleanroom class or contamination control procedures, lot-level wafer maps, and supplier process flow documentation as contract deliverables.
  • Deliverables specify electrical parametric test data, device acceptance criteria, first article test reports, and lot traceability linked to serial or wafer identifiers.
  • Evaluation criteria request prior manufacturing runs, process control records, defect density metrics, and ability to provide per-lot test data and traceability.

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