Federal NAICS Codes

NAICS 334413: Semiconductor and Related Device Manufacturing

Explore obligations, trends, recent awards, and incumbent contractors for NAICS 334413.

NAICS 334413 federal market metrics

Total obligations
$3.8B
Total awards
61,662 awards
Active obligations
$419M
Size standard
1,250 employees

What this NAICS covers

NAICS 334413 covers fabrication and manufacturing of semiconductors and related devices, including wafer processing, die fabrication, packaging, assembly, electrical and environmental testing, and maintenance of process control and quality records for device production.

Federal opportunities under 334413 typically involve acquiring manufactured semiconductor devices or production services, including lot acceptance testing, qualification reports, manufacturing traceability, environmental and electrical test data, and delivery of parts with specified production and quality documentation.

FY2025 snapshot

Obligations
$184.1M
Awards
2,794
Average award
$65.9K
Change from FY2024
+13.6%

Recent awards

Search contractors

$78,204

DATA DEVICE CORP

National Aeronautics and Space Administration

PIID
80NSSC26P1350
PSC
7E21 - IT AND TELECOM - MOBILE DEVICE PRODUCTS (HARDWARE AND PERPETUAL LICENSE SOFTWARE)

$30,450

NUMED TECHNOLOGIES, L.L.C.

National Aeronautics and Space Administration

PIID
80NSSC26P1348
PSC
7A20 - IT AND TELECOM - APPLICATION DEVELOPMENT SOFTWARE (PERPETUAL LICENSE SOFTWARE)

$165,863

MICROCHIP TECHNOLOGY INC

National Aeronautics and Space Administration

PIID
80NSSC26P1289
PSC
5805 - TELEPHONE AND TELEGRAPH EQUIPMENT

$90,285

SINGULAR PHOTONICS LIMITED

National Aeronautics and Space Administration

PIID
80NSSC26P1222
PSC
DE01 - IT and Telecom - End User: Help Desk; Tier 1-2, Workspace, Print, Output, Productivity Tools (Labor)

$18,322

AB GROUP INC

National Institute of Standards and Technology

PIID
1333ND26PNB770298
PSC
6650 - OPTICAL INSTRUMENTS, TEST EQUIPMENT, COMPONENTS AND ACCESSORIES

$124,920

RPMC LASERS INC.

National Aeronautics and Space Administration

PIID
80NSSC26P1184
PSC
6695 - COMBINATION AND MISCELLANEOUS INSTRUMENTS

$243,410

AVNET INC

National Aeronautics and Space Administration

PIID
80NSSC26P1147
PSC
5999 - MISCELLANEOUS ELECTRICAL AND ELECTRONIC COMPONENTS

$47,400

K5 DEFENSE LLC

National Oceanic and Atmospheric Administration

PIID
1305M226P0175
PSC
5961 - SEMICONDUCTOR DEVICES AND ASSOCIATED HARDWARE

FAQ

What work fits NAICS 334413?
  • Wafer fabrication run for a requested device process flow with lot-level identification, wafer maps, and electrical parametric data supplied to the procuring organization.
  • Assembly and packaging of semiconductor dies into specified packages with final electrical test reports, burn-in records, and lot traceability.
  • Supply of packaged microcontrollers or discrete devices with per-lot test summaries, acceptance data, and certificate of conformance.
  • Contracted production of photodiodes or sensor dies including die attach, encapsulation or packaging, and delivery of device-level test data.
When is NAICS 334413 a weak fit?
  • Integrated circuit design services where the primary deliverable is design files, RTL, or IP rather than fabrication and manufacturing process execution.
  • Printed circuit board assembly contracts where work centers on component placement and board-level assembly rather than wafer processing or semiconductor die fabrication.
  • Electronic systems box-build procurements where components are purchased and integrated into systems and the prime activity is assembly and integration, not semiconductor device manufacture.
What solicitation language points to NAICS 334413?
  • Requirements list cleanroom class or contamination control procedures, lot-level wafer maps, and supplier process flow documentation as contract deliverables.
  • Deliverables specify electrical parametric test data, device acceptance criteria, first article test reports, and lot traceability linked to serial or wafer identifiers.
  • Evaluation criteria request prior manufacturing runs, process control records, defect density metrics, and ability to provide per-lot test data and traceability.

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