Federal NAICS Codes

NAICS 334418: Printed Circuit Assembly (Electronic Assembly) Manufacturing

Explore obligations, trends, recent awards, and incumbent contractors for NAICS 334418.

NAICS 334418 federal market metrics

Total obligations
$6B
Total awards
45,379 awards
Active obligations
$124.2M
Size standard
750 employees

What this NAICS covers

NAICS 334418 covers assembling printed circuit assemblies, including component placement, soldering of surface-mount and through-hole components, functional and in-circuit testing, conformal coating, firmware loading when part of assembly, and maintaining manufacturing quality records.

Federal opportunities under 334418 typically involve procuring production quantities of printed circuit assemblies that meet specified electrical and environmental performance, delivering test reports, traceability of components, manufacturing process documentation, configuration control, and acceptance testing for operational readiness.

FY2026 snapshot

Obligations
$78.4M
Awards
1,521
Average award
$51.5K
Change from FY2025
-6.8%

Recent awards

Search contractors

$28,022

SIERRA CIRCUITS, INC.

National Aeronautics and Space Administration

PIID
80NSSC26P1596
PSC
5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE

$118,053

MANNCORP INC

National Aeronautics and Space Administration

PIID
80NSSC26P1581
PSC
7E20 - IT and Telecom - End User: Help Desk;Tier 1-2,Workspace,Print,Output,Productivity Tools (HW/Perp SW)

$22,655

THE W.W. WILLIAMS COMPANY, LLC

US Coast Guard

PIID
70Z08026P20259B00
PSC
5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE

$33,036

LARITECH, INC.

National Oceanic and Atmospheric Administration

PIID
1305M226P0159
PSC
5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE

$171,000

OPTO 22

Federal Aviation Administration

PIID
6973GH26P02055
PSC
5963 - ELECTRONIC MODULES

$56,917

AIM ELECTRONICS DISTRIBUTORS INC

Federal Aviation Administration

PIID
692M1526P00071
PSC
3670 - SPECIALIZED SEMICONDUCTOR, MICROCIRCUIT, AND PRINTED CIRCUIT BOARD MANUFACTURING MACHINERY

$26,268

H C MERCHANDISERS, INC.

Defense Logistics Agency

PIID
SPE7M526P3920
PSC
5998 - ELECTRICAL AND ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE

FAQ

What work fits NAICS 334418?
  • Turnkey PCB assembly from kitted BOM through pick-and-place, soldering, optical inspection, functional testing, and delivery with test reports.
  • Low- to medium-volume assembly runs providing conformal coating, custom fixtures, and documentation for ruggedized or aerospace-grade board assemblies.
  • Manufacturing rework during assembly runs, including BGA rework, component replacement, X-ray inspection, and final functional verification before lot acceptance.
  • Develop in-circuit and functional test procedures, build test jigs, perform boundary-scan programming, and deliver test documentation for production acceptance.
When is NAICS 334418 a weak fit?
  • Bare-board fabrication contracts that supply unpopulated printed circuit boards because PCB fabrication requires lamination, etching, and drilling rather than assembly and test.
  • System-level integration procurements delivering completed line-replaceable units with enclosures and embedded software because those scopes include mechanical housings and system integration beyond board assembly.
  • Component distribution or consignment agreements where the vendor provides parts only and does not perform assembly or testing because assembly, soldering, and test traceability are not provided.
What solicitation language points to NAICS 334418?
  • Line items specify PCB assemblies by revision with kitted parts, AOI/X-ray inspection, defined test procedures, and quantities per lot.
  • Labor categories include SMT operator, solder technician, test engineer, and electro-mechanical assembler with required certifications or IPC credentials.
  • Contract clauses require first-article inspection, lot acceptance testing, serial or lot traceability, and corrective action reporting for test failures.

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